A method for applying a polymeric resist coating of very high molecular weight to a suitable substrate without the necessity of elaborate purification steps and for ensuring adequate coverage of raised regions in three-dimensionally patterned substrates. The method comprises exposing the substrate to be coated to the vapor of an anionically polymerizable monomer of the formula: CHR=CXY where X and Y are strong electron withdrawing groups R si H or, provided that X and Y are both -CN,C1-C4 alkyl for sufficient time to deposit a polymerizable coating thereon.

Here we report the preparation of mechanically robust silica aerogel polymer nanocomposites using surface-initiated atom transfer radical polymerization. This approach was used to grow poly(methyl methacrylate) (PMMA) with low polydispersities and establish the first structure–property relationship between the grafted PMMA molecular weight and bulk physical properties of the hybrid aerogel.

Strong polymer−silica aerogel composites were prepared by chemical vapor deposition of cyanoacrylate monomers onto amine-modified aerogels. Amine-modified silica aerogels were prepared by copolymerizing small amounts of (aminopropyl)triethoxysilane with tetraethoxysilane. After silation of the aminated gels with hexamethyldisilazane, they were dried as aerogels using supercritical carbon dioxide processing.

Curable compositions that comprise two separately curable chemistry sets or compositions with curing temperatures sufficiently separated so that one chemistry composition can be fully cured during a B-staging process, and the second can be left uncured until a final cure is desired, such as at the final attach of a semiconductor chip to a substrate.

The intent of this article is to bring to light the capabilities of selectively applied PSAs to ensure you of a successful first experience.
Screen-printable pressure–sensitive adhesives (PSAs) are liquid adhesives that can be selectively applied and provide surface tack once dry. Although PSAs are used for many of the same applications as laminating adhesives (also known as transfer tapes), they don’t have to be diecut and hand positioned. You print them only where you want them.

The dominant trend in packaging DDR DRAM for the future is the face down substrate-on-chip configuration. For this type of package it is critical that the die attach method employed provide precise control of bond line thickness and die tilt, minimal fillet, and prevent contamination of the wire bond pads located on the edge of the center wire bond channel. To date, a film adhesive has been the die attach method of choice because it is well suited to meet those requirements.

MATERIAL SAFETY DATA SHEET 3M™ SP7514, NPE 5 / 226

An adhesive compostion, of the 'instant adhesive' type, comprising:

(a) from 77 to 95% by wight of monomeris 2'-ethoxyethyl 2 cyanoacrylate;

(b) from 3 to 15% by wight of a poly-(C1-5) alkyl acrylate of methacrylate having an average molecular wight within the range from 400,000 to 600,000;

(c) from 2 to 8% by wights of hydrophobic fumed silica; and

(d) from 100 to 1000 ppm by wight of a polymerization stabilizer;

A cyanoacrylate adhesive composition in thixotropic paste form is made by mixing a liquid cyanoacrylate ester with powdered organic fillers selected from (i) polycarbonates, (ii) polyvinylidene fluorides, (iii) polyethylenes, and (iv) acrylic block copolymer resins containing saturated elastomer segments. Concentration of the filler is about 5 to 100 parts by weight. Particle size of the filler is about 2 to 200 microns.

A brief review is given about the development of rubber isostatic pressing (RIP) of powders for magnets and other materials that includes: principles of RIP; RIP apparatuses; recent progress; and advantages of RIP. As the recent progress, a new filling technique, ‘air tapping (AT) and grid separation (GS)’, is presented.