Technical documentation

Dual Cure B-Stageable Adhesive for Die Attach

US20030129438

By:

Curable compositions that comprise two separately curable chemistry sets or compositions with curing temperatures sufficiently separated so that one chemistry composition can be fully cured during a B-staging process, and the second can be left uncured until a final cure is desired, such as at the final attach of a semiconductor chip to a substrate.

Screen Printable Adhesives as an Alternative to Pressure Sensitive Tapes

By:

Lisa Castillo

The intent of this article is to bring to light the capabilities of selectively applied PSAs to ensure you of a successful first experience.
Screen-printable pressure–sensitive adhesives (PSAs) are liquid adhesives that can be selectively applied and provide surface tack once dry. Although PSAs are used for many of the same applications as laminating adhesives (also known as transfer tapes), they don’t have to be diecut and hand positioned. You print them only where you want them.

Printable Die Attach Adhesives for Substarte-On-Chip Packaging

By:

Kevin Becker

Timmy Lin

The dominant trend in packaging DDR DRAM for the future is the face down substrate-on-chip configuration. For this type of package it is critical that the die attach method employed provide precise control of bond line thickness and die tilt, minimal fillet, and prevent contamination of the wire bond pads located on the edge of the center wire bond channel. To date, a film adhesive has been the die attach method of choice because it is well suited to meet those requirements.

Screen Printable adhesive

3MTM SP7514, NPE 5 / 226

By:

MATERIAL SAFETY DATA SHEET 3M™ SP7514, NPE 5 / 226

Adhesive

US4997861

By:

Dieter A. Hechenberger

Aurelia A. Liar

An adhesive compostion, of the 'instant adhesive' type, comprising:

(a) from 77 to 95% by wight of monomeris 2'-ethoxyethyl 2 cyanoacrylate;

(b) from 3 to 15% by wight of a poly-(C1-5) alkyl acrylate of methacrylate having an average molecular wight within the range from 400,000 to 600,000;

(d) from 100 to 1000 ppm by wight of a polymerization stabilizer;

Cyanoacrylate Adhesive Paste Compostion

US4105715

By:

Edward R. Gleave

A cyanoacrylate adhesive composition in thixotropic paste form is made by mixing a liquid cyanoacrylate ester with powdered organic fillers selected from (i) polycarbonates, (ii) polyvinylidene fluorides, (iii) polyethylenes, and (iv) acrylic block copolymer resins containing saturated elastomer segments. Concentration of the filler is about 5 to 100 parts by weight. Particle size of the filler is about 2 to 200 microns.

Rubber Isostactic Pressing (RIP) of Powders for Magnets and Other Materials

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A brief review is given about the development of rubber isostatic pressing (RIP) of powders for magnets and other materials that includes: principles of RIP; RIP apparatuses; recent progress; and advantages of RIP. As the recent progress, a new filling technique, ‘air tapping (AT) and grid separation (GS)’, is presented.

Bubble Nucleation in Stout Beers

By:

W. T. Lee

J. S. McKechnie

M. Devereux

Bubble nucleation in weakly supersaturated solutions of carbon dioxide—such as champagne, sparkling wines and carbonated beers—is well understood. Bubbles grow and detach from nucleation sites: gas pockets trapped within hollow cellulose ﬁbres. This mechanism appears not to be active in stout beers that are supersaturated solutions of nitrogen and carbon dioxide. In their canned forms these beers require additional technology (widgets) to release the bubbles which will form the head of the beer.

Rubber Isostatic Pressing (RIP) for Ferrite Magnets

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Applying RIP (Rubber Isostatic Pressing) to the ferrite sintered magnets, the following have been developed: (1) Ferrite sintered magnets having energy product as high as 5.12 MGOe (2) RIP setup for arc-segment magnets

Development of the powder reaction moulding process

By:

Lei Zhao

Maurice N. Collins

Colin Birkinshaw

Abstract BACKGROUND: The powder reaction moulding process uses a reactive monomer as carrier and binder for the moulding of metal or ceramic powders. De-binding is achieved using thermal depolymerisation which is followed by sintering to give the finished component. Binder can be recovered for re-use. RESULTS: Moulding compounds, with various powder volume fractions, have been prepared using stainless steel, silicon nitride and alumina with n-butyl cyanoacrylate as binder, and the stability of the compounds established.

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