The Effect of Fillers Upon the Properties of Electrocinductive Cyanoacrylate Adhesives
The Effect of Fillers Upon the Properties of Electrocinductive Cyanoacrylate Adhesives
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Abstract:
The influence of type and size of filler particles and viscosity of the cyanoacrylate component on the volume resistivity, conductivity mechanism and adhesive strength of the resultant bond has been investigated. Various carbon and metal fillers were used to make conductive cyanoacrylate adhesive compositions and the best results were obtained when Ag, Ni or Mo powders (5–10 μm) were incorporated in thickened ethyl 2-cyanoacrylate with a viscosity of 50–100 cP
DOI:
10.1016/0143-7496(88)90092-9
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The effect of fillers upon the
properties of electroconductive
cyanoaerylat
esflres
K.G. Chorbadjiev and D.L. Kotzev
(Scientific Research Centre for Specialty Polymers, Bulgaria)
The influence of type and size of filler particles and viscosity of the cyanoacrylate
component on the volume resistivity, conductivity mechanism and adhesive strength of
the resultant bond has been investigated. Various carbon and metal fillers were used
to make conductive cyanoacrylate adhesive compositions and the best results were
obtained when Ag, Ni or Mo powders (5-10 pm) were incorporated in thickened ethyl
2-cyanoacrylate with a viscosity of 50-100 cP.
Key words: electroconductive adhesives; cyanoacrylate adhesives; adhesive-bonded
joints; adhesive strength
Adhesive compositions with electroconductive
properties are finding increased application in the
electronics industry for assembly of various electronic
components L 2. They are of most use when the
components cannot withstand the temperature of
soldering.
Cyanoacrylate conductive adhesives, when
compared to the traditional epoxy and acrylic based
conductive adhesives 3 have the following strong points:
• short setting time at room temperature and
humidity without use of catalysts;
• one component adhesives;
• strong bonding action towards various materials
(metals, plastics, ceramics, etc);
• satisfactory electroconductivity of adhesive bond;
• easy to work with.
The only available commercial product, 'Saikoron B'
(Japan), based on ethyl 2-cyanoacrylate and silver
powder, has a setting time of 3-4 rain and a volume
resistivity of the bond 1-6.10 -4 N.cm 2, 3. The methods
for obtaining electroconductive cyanoacrylate
adhesives, described in the patent literature 4-s, deal
mainly with the compatibility of the highly reactive
cyanoacrylate monomers with metal and carbon fillers.
As part of the research to synthesize conductive
cyanoacrylate adhesives, the objective of the present
work was to determine the influence of the type and
size of metallic and carbon fillers and the viscosity of
the cyanoacrylate component on the volume resistivity,
conductivity mechanism and the strength of the
resultant bond.
Experimental details
Ethyl 2-cyanoacrylate (ECA) with a viscosity of 2-4 cP
and ECA thickened with poly(methyl methacrylate) with
viscosities of 50 cP, 100 cP and 500 cP were used. The
material was commercial grade 'Kanokonlit' (Bulgaria)
cyanoacrylate adhesive. The materials tested as
conductive fillers are shown in Table 1.
The adhesive compositions were prepared according
to References 7 and 8. The carbon fillers (carbon black
and graphite) were mixed directly with ECA at room
temperature until homogeneous compositions were
obtained. At room temperature the compositions have
setting times in the range of 10-20 min and a shelf life
of over 4 months. In order to prevent spontaneous
polymerization of the adhesive, the metal powder fillers
were washed at 30-80°C with diluted solutions of
inorganic or organic acids prior to mixing with the
cyanoacrylate. The compositions containing metal
fillers had setting times of 5-20 min and a shelf life of
up to l0 days after mixing.
Volume resistivity was determined according to
ASTM D 2739-72. Brass tensile adhesion specimens
with electrical connections were used. Resistivity was
measured 24 h after adhesive application at 23 + I°C
and 50 +_ 5% RH with a Kelvin bridge, calibrated to 1%
accuracy.
Tensile shear strength tests, performed on bonded
steel joints having dimensions specified in ASTM
D-1002, were conducted 24 h after bonding at room
temperature with a Zwick 1474 testing machine with a
constant cross-head speed of 50 mm min -l.
0 1 4 3 - 7 4 9 6 / 8 8 / 0 7 0 1 4 3 - 0 4 $03.00 © 1988 Butterworth 8 Co (Publishers) Ltd
INT.J.ADHESION AND ADHESIVES VOL.8 NO.3 JULY 1988
143
T a b l e 1.
P o w d e r fillers u s e d for p r e p a r a t i o n of c o n d u c t i v e c y a n o a c r y l a t e a d h e s i v e s
Type
Particles mean diameter
(pm)
Carbon black
Graphite
0.04
Up to 1 0 0
Ag
Source
GDR (P-1250)
Bulgaria (technical grade)
Laboratory reduction of AgNO 3 with AI
Fluka, Switzerland
Fluka, Switzerland
Fluka, Switzerland
Fluka, Switzerland
Fluka, Switzerland
Fluka, Switzerland
Fluka, Switzerland
5
Ni
Me
Fe
Cr
W
AI
Cu
10
10
20-80
20-80
20-8O
5
5
Results
and discussion
Fig. 1 shows the effect of type and quantity of filler on
the conductivity of the adhesive bond. The tested fillers
can be divided into four groups with respect to
resistivity of the bond as a function of their quantity in
the composition:
Group
Group
Group
Group
1 -2 -3 -4 --
carbon black and graphite
Ag, Me, Ni
Cu, A1
W, Cr, Fe.
Fig. 2 shows the dependence of adhesive strength on
filler quantity. In this case the grouping of the metal
powders is also maintained, and for clarity the
dependence for only one typical representative of each
group is shown. From the results shown in Figs 1 and
2 it is evident that high conductivity cannot be
achieved with carbon fillers. The adhesive strength for
graphite-filled composition is lower than the carbon
black composition. For Group 2 fillers (Ag, Me, Ni)
conductivity of the bond increases with the increase of
filler content, while the adhesive properties are
maintained within reasonable values. Tensile shear
~7
X
&
•
strength of the bond drops sharply when the filler
content exceeds 70%. Group 3 (AI and Cu) based
adhesives cannot achieve a high degree of filling and
conductivity and tensile shear strength is low. Even at
low filler content cohesive failure mode occurs. Group
4 fillers (Fe, Cr, W) are powders with larger particle
size and high density. The conductivity of their
adhesive bonds reaches acceptable values when the
filler content is above 75%. However, at this filler
concentration the adhesive strength of the bond drops
sharply. The adhesive compositions of this group of
fillers shows a tendency towards aggregation of the
metal particles.
The value 'critical degree of filling' was used as a
measure of the viscosity of the adhesive compositions.
It represents the highest viscosity limit of the
composition at which adhesive application is still
acceptable. Practical determination was carded out in
accordance with the procedure described in Reference
9. Some adhesive (0.5 _+ 0.01 g) is placed between two
glass discs and a load of 100 g is placed in the centre
for 60 s. The diameter of the spread adhesive is then
measured. The composition viscosity at which the
adhesive spreads in a diameter of 7 mm is considered
as the 'critical degree of filling'. Fig. 3 shows the
dependence of the quantity of filler on the viscosity of
the cyanoacrylate component at the critical degree of
filling. Increasing the viscosity of the cyanoacrylate
2
20;
el
-'>
0
\
__
°
_A
==
o Ni
iMo
• Fe
-(
I0
~7 Cu
• Cr
AW
I
3(3
•
I
50
Filler (weight%)
I
70
\:%:.
~
!
"~'~_
v
0
I
90
Fig. 1 Effectof type and quantity of filler on the conductivityof
cyanoacrylateadhesivebond.
(ethyl 2-cyanoacrylatewith viscosityof 50 cP used)
144
• AI
x Groph,~
\;
INT.J.ADHESION AND ADHESIVES JULY 1 9 8 8
0
+,.
I
20
I
40
1
60
Filler (weight %)
Fig. 2
/
Dependence of adhesive strength o n filler content in
cyanoacrylate conductive adhesive.
(ethyl 2-cyanoacrylatewith viscosityof 50 cP used)
i
80
,, , •
90.A.....,,
vCu
x Grophite
+ Corbon
block
• Cr
Weight %
60
40
30
80
• Ag
5 z 7¢
ii
60
,V
cl
.:>
~
o
512 ~
3C
~
+
/
÷ Corbon block
o AJ
• Ag
x Graphite
• Cr
I
~
o
~
t
Weight %
• Ag
•
+
~
~
~
-
e
.
.
o
x
~
m
e~al
I
5 O
O
Fig. 3 Dependence of filler content at critical degree of filling on the
viscosity of cyanoscrylate component
15
÷
o,
+
I
i
I00
200
300
400
Viscosity of cyonoocrylote component (cP)
0
o,
X
i
== -2
¢D
~
60
Cr
80
Corbon 40
block
AI
50
Grophite 60
Q.
=S
-!
0
•
I
I00
I
200
I
300
I
400
Viscosity of cyanoocrylote component (cP)
Fig. 5 Dependence of adhesive bond's volume resistivity on the viscosity
of cyanoacrylate component
transfer through a thin polymer layer, the so-called
tunnel effect ,u. Determining the value of n in the
•equation:
I = c~
..--O
f
0
O
f
I
5O
K~O
5O0
Viscosity of cyonoocrylote component (cP)
Fig. 4 Dependence of tensile shear strength of adhesive bond on the
viscosity of cyanoscrylate component
lowers the maximum quantity of filler that can be
incorporated into the adhesive composition. More
pronounced is the dependence of the filler content, at
critical degree of filling, on the size of the filler
particles. Increasing the filler particle size increases the
amount of filler that can be accommodated in the
composition.
Figs 4 and 5 show the dependence of tensile shear
strength and volume resistivity of the adhesive bond on
the viscosity of the cyanoacrylate component. In most
cases the tensile shear strength has a maximum when
the cyanoacrylate component has a viscosity in the
range of 50-100 cP. On the other hand, the volume
resistivity of the adhesive bond is not affected to a
great extent by the viscosity of the cyanoacrylate base
component. Only in the case of carbon fillers is
conductivity reduced by the increase of the
cyanoacrylate viscosity.
The conductivity mechanism of polymeric
compositions containing conductive fillers is based on
two possible effects; electric charge transfer through
direct contact of filler particles and/or electric charge
I
500
(l)
where I = current intensity, Y = applied potential,
c and n are constants, can clarify the conductivity
mechanism. When n = 1 the so called ohmic
conductivity occurs and the volume resistivity is not
dependent on the applied potential. When n > 1 the
conductivity is determined by the 'tunnel effect' charge
transfer through the polymer layer and the volume
resistivity becomes dependent on the applied potential.
Conductivity increases with the increase of the
potential. Table 2 shows the values of n as a function
of type and quantity of filler for various cyanoacrylate
adhesive compositions. The value of n was determined
by linear approximation. It can be seen that, even at
critical degree of filling, n > 1 for carbon fillers. The
transfer of electric current is determined by the
polymer matrix. Similar results for n are obtained for
Al and Cu based compositions. This can be explained
by the exceptionally good wettability of these metal
particles by the cyanoacrylate monomer. The
subsequent polymerization of the monomer eliminates
the possibility for direct contact of the metal particles.
For the third group fillers (Fe, Cr, W) in the critical
degree of filling range, n becomes almost 1. This can
be explained by the amount of filler accepted into the
composition, its relatively large particle size and their
tendency to aggregate. The best results and ohmic
conductivity are displayed when Ag, Ni and Mo
powders are used as fillers. Also, it can be concluded
from the data in Table 2, that the increase of viscosity
of the cyanoacrylate component raises the value of n.
This is a result of the uniform distribution of the filler
particles in the adhesive and, hence, in the formed
polymer bond.
Conclusions
The conductivity and strength characteristics of the
obtained cyanoacrylate adhesives depend primarily on
INTJ.ADHESION AND ADHESIVES JULY 1988
145
Table 2. Conductivity mechanism of cyanoacrylate adhesive bonds as a function of type and quantity of filler
and viscosity of cyanoacwlate component
Value of n where / = c-V n
Type of
filler
Filler
content
(weight %)
cyanoacrylate
with 2 cP
viscosity
cyanoacrylate
with 50 cP
viscosity
cyanoacry(ate
with 100 cP
viscosity
cyanoacrylate
with 500 cP
viscosity
Carbon black
20
30
40
50
2.15
2.09
1.83
1.42
2.32
2.18
2.01
1.64
2.40
2.30
2.00
1.83
2.55
2.40
2.20
2.06
Graphite
30
40
50
60
70
2.04
1.84
1.52
1.34
1.20
2.22
2.10
1.72
1.53
1.40
2.32
2.15
2.00
1.42
1.56
2.44
2.30
2.10
1.85
1.42
Ag
20
30
40
50
60
70
1.47
1.15
1.02
1.00
1.00
1.00
1.58
1.20
1.05
1.06
1.02
1.02
1.64
1.34
1.12
1.07
1.08
1.06
1.65
1.44
1.15
1.10
1.12
1.10
Cu
40
50
60
70
1.92
1.98
1.96
1.94
! .94
2.12
2.32
2.00
2.18
2.23
2.13
2.12
2.07
2.01
2.06
2.00
Cr
40
50
60
70
80
85
2.54
2.00
1.89
1.42
1.32
1.10
2.60
2.20
2.05
1.43
1.21
1.05
2.64
2.10
1.84
1.58
1.15
1.04
2.58
1.88
1.70
1.25
1.05
1.03
the type, quantity and size of the conductive filler. The
viscosity of the cyanoacrylate component has little
influence on the conductivity, but a more pronounced
effect on the adhesive strength of the bond. The best
results are obtained when Ag, Ni or Mo powders
(5-10pm) are incorporated into thickened ethyl 2cyanoacrylate with a viscosity of 50-100 cP.
References
I
Gul, V.E. and Shenfild, L.Z. 'Adhesives and coatings for the
electronics" in "Electroconductive Polymer Compositions"(Himia,
Moscow, USSR, 1984) pp 217-222
2
Suzuki, Y. "Characteristics and use of electroconductive adhesive
Saikoron B" Kogyo Zaityo 32 No 2 (1984) lap 106-109
3
Suzuki, Y. 'Electroconductive instant setting adhesives' Kogyo
Zairyo 33 No 2 (1985) pp 4 6 - 5 0
4
Inoue, K. Japanese Patent 73 036 (1976)
146
INT.J.ADHESION AND ADHESIVES JULY 1988
5
Inoue, K. Japanese Patent 74 626 (1977)
6
Taoka Gosei Chemical Co. Japanese Patent 118 776 (1985)
7
Chorllxidjiev, IL, Kotzev, D. end Kabeivanov, V. Bulgarian Patent
41054 (1987)
8
Chorbedjiev, K., Kotzev, D. end Kabeivanov, V. Bulgarian Patent
41055 (1987)
9
Gul, V.E. end Shenfild, L.Z. 'Electroconductive adhesives' in
"Electroconductive Polymer Compositions"(Himia, Mescow, USSR,
1984) p 70
10
Van Beek, L.K. end Van Pul, B.I. 'Non-ohmic behaviour of carbon
black loaded rubbers' Carbon 2 No 2 (1964) pp 121-126
Authors
The authors are with The Scientific Research Centre
for Specialty Polymers, Kliment Ohridski St 4A, 1156
Sofia, Bulgaria. Enquiries should be addressed to
Dr D.L. Kotzev.
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