moulding

Abstract BACKGROUND: The powder reaction moulding process uses a reactive monomer as carrier and binder for the moulding of metal or ceramic powders. De-binding is achieved using thermal depolymerisation which is followed by sintering to give the finished component. Binder can be recovered for re-use. RESULTS: Moulding compounds, with various powder volume fractions, have been prepared using stainless steel, silicon nitride and alumina with n-butyl cyanoacrylate as binder, and the stability of the compounds established.