Screen Printable Adheives

Curable compositions that comprise two separately curable chemistry sets or compositions with curing temperatures sufficiently separated so that one chemistry composition can be fully cured during a B-staging process, and the second can be left uncured until a final cure is desired, such as at the final attach of a semiconductor chip to a substrate.

The intent of this article is to bring to light the capabilities of selectively applied PSAs to ensure you of a successful first experience.
Screen-printable pressure–sensitive adhesives (PSAs) are liquid adhesives that can be selectively applied and provide surface tack once dry. Although PSAs are used for many of the same applications as laminating adhesives (also known as transfer tapes), they don’t have to be diecut and hand positioned. You print them only where you want them.

The dominant trend in packaging DDR DRAM for the future is the face down substrate-on-chip configuration. For this type of package it is critical that the die attach method employed provide precise control of bond line thickness and die tilt, minimal fillet, and prevent contamination of the wire bond pads located on the edge of the center wire bond channel. To date, a film adhesive has been the die attach method of choice because it is well suited to meet those requirements.

MATERIAL SAFETY DATA SHEET 3M™ SP7514, NPE 5 / 226